High throughput electrochemically driven metal microprinting with multicapillary droplet cell

A high speed and low-cost electrochemical additive manufacturing method for parallel microprinting of metals is proposed. Multicapillary 3D printed solution flow type microdroplet cells (Sf-MDC) with large capillary diameters (600 μm) are used to electrodeposit high-quality Ni microstructures. Three lines each having a width around 900 μm thickness 24.6 μm, 20.7 15.2 simultaneously on Cu substrate. The influence temperature scanning the height studied. Independent control solutions inside enables simultaneous formation Ni-Cu-Ni Cu-Ni-Cu microdots without any cross-mixing solutions. By replacing inner capillaries (around 600 in diameter) silica 100 Sf-MDC, free standing structures such as microrods successfully fabricated. Localized electrodeposition using Sf-MDC allows process printing metal microstructures wide range applications.